Semiconductor Process Integration Engineer | Nagoya

Join a world-class semiconductor foundry specialising in advanced 300mm wafer fabrication as a Semiconductor Process Integration Engineer in Nagoya, Japan. This permanent opportunity focuses on semiconductor process development, wafer manufacturing optimisation and the successful introduction of new technologies into mass production.

You will play a central role in semiconductor process integration, process engineering and high-volume manufacturing, helping ensure that advanced semiconductor products move efficiently from development into stable commercial production.

The position involves designing and executing process integration methodologies to support new product development, technology qualification, manufacturing ramp-up and ongoing process stability.

A key responsibility will be collaborating with unit process development teams to establish design rules, define technical specifications and ensure that individual manufacturing processes are effectively integrated into complete semiconductor fabrication flows.

You will also lead technical initiatives focused on wafer yield improvement, defect reduction, process stabilisation and manufacturing quality, contributing directly to the performance and productivity of large-scale fabrication facilities.

Working closely with internal engineering teams and international foundry customers, you will support technology transfer and technology porting programmes, helping bring high-value-added semiconductor technologies into mass production.

Beyond manufacturing process development, you will assess opportunities to improve fab productivity, equipment utilisation and operational efficiency through process enhancements and the introduction of new manufacturing equipment.

The role also involves leveraging existing foundry technology platforms and technical capabilities to support business development and the acquisition of new commercial programmes.

This opportunity is ideal for engineers with experience in semiconductor process integration, module process development, wafer fabrication, semiconductor production engineering or yield improvement who want to deepen their expertise in advanced semiconductor manufacturing.

Key Responsibilities

• Design, develop and execute semiconductor process integration methodologies to support new technology development and successful manufacturing ramp-up.
• Coordinate integration activities across advanced 300mm wafer fabrication processes.
• Support the introduction of new semiconductor products and high-value-added technologies into stable mass production.
• Work closely with unit process development and module engineering teams to integrate individual process steps into complete manufacturing flows.
• Define and refine semiconductor design rules, technical specifications and process integration requirements for high-volume manufacturing.
• Support international foundry customers through technology transfer and technology porting programmes.
• Design, evaluate and optimise semiconductor fabrication processes to improve manufacturability and production stability.
• Lead engineering initiatives focused on wafer yield improvement, defect reduction and manufacturing quality.
• Investigate process-related technical challenges and implement improvements that enhance production reliability and process consistency.
• Evaluate new process technologies and manufacturing equipment introductions to improve fab productivity and efficiency.
• Collaborate with cross-functional engineering and manufacturing teams to resolve complex integration issues.
• Apply existing foundry technology platforms and technical assets to support new business opportunities and commercial programme acquisition.
• Contribute to continuous improvements in semiconductor manufacturing processes, operational performance and technology readiness.
• Coordinate technical information and engineering requirements with relevant internal teams and international stakeholders.

Required Skills and Qualifications

Experience:

• Technical college (KOSEN) graduation or higher in Engineering, Science or a related technical discipline.
• Practical engineering experience in semiconductor process development.
• Hands-on experience working with module process technology in semiconductor manufacturing.
• Demonstrated background in semiconductor process integration.
• Practical knowledge of semiconductor production engineering and wafer fabrication processes.
• Ability to understand and coordinate technical requirements across multiple semiconductor manufacturing process steps.
• Experience supporting the development, evaluation or improvement of semiconductor manufacturing processes.
• Understanding of process stability, production quality and engineering problem-solving within semiconductor fabrication environments.

Soft Skills:

• Proactive and independent working style, with the ability to take ownership of complex process integration challenges.
• Strong commitment to continuous learning and developing expertise in next-generation semiconductor technologies.
• Excellent cross-functional collaboration skills when working with multidisciplinary engineering and manufacturing teams.
• Clear and effective technical communication skills.
• Analytical approach to identifying process issues, evaluating technical options and implementing practical improvements.
• Strong sense of responsibility, quality awareness and continuous improvement.
• Ability to collaborate effectively with process development, production engineering and manufacturing stakeholders.

Language Requirements:

• Japanese: Fluent proficiency for effective collaboration with domestic engineering and manufacturing teams.
• English: Not mandatory as a core qualification, but TOEIC 500 or above is preferred, together with the ability to review and prepare technical PowerPoint presentations and communicate with global headquarters and overseas customers.

Preferred Skills & Qualifications

• English proficiency equivalent to TOEIC 500 or above, including technical documentation and presentation skills.
• Experience communicating with global headquarters, international engineering teams or overseas semiconductor customers.
• Practical experience in flash memory manufacturing or process development.
• Knowledge of non-volatile memory technologies and semiconductor fabrication processes.
• Experience with specialised semiconductor device fabrication.
• Familiarity with technology transfer, process qualification or manufacturing ramp-up.
• Experience contributing to wafer yield improvement, process stabilisation or fab productivity initiatives.

About the Company

Our client is an established world-class semiconductor foundry operating large-scale 300mm wafer fabrication facilities in Japan.

Backed by a premier global semiconductor manufacturing group, the company combines advanced manufacturing capabilities with international technical expertise and an established semiconductor industry network.

Its technology portfolio includes advanced logic semiconductor technologies, specialised semiconductor devices and integrated foundry solutions.

The organisation supports technology innovators around the world, providing specialised manufacturing capabilities that help bring advanced semiconductor designs into commercial production.

Its engineering teams play an essential role in semiconductor process development, technology integration, manufacturing optimisation and high-volume production readiness.

The company emphasises engineering excellence, stable manufacturing operations and continuous technical improvement, creating an environment where process engineers can contribute directly to advanced semiconductor production.

Joining this organisation offers the opportunity to work on complex process integration challenges, new semiconductor technologies and large-scale wafer manufacturing programmes, while building a long-term career in Japan's semiconductor industry.

Why You'll Love Working Here

• Join a world-class semiconductor foundry operating advanced 300mm wafer fabrication facilities.
• Work within an established organisation backed by a leading global semiconductor manufacturing group.
• Contribute to advanced logic semiconductor technologies and specialised device manufacturing.
• Play an important role in new technology introduction and semiconductor mass-production ramp-up.
• Develop expertise in semiconductor process integration, module process development and wafer fabrication.
• Lead technical improvements in wafer yield, defect reduction, process stability and manufacturing quality.
• Support technology transfer and technology porting programmes for international foundry customers.
• Collaborate with multidisciplinary engineering teams and global technical stakeholders.
• Gain exposure to process technology development, equipment introduction and fab productivity improvement.
• Enjoy an excellent work-life balance with 126 annual holidays.
• Benefit from 23 days of annual paid leave.
• Take advantage of flexible flextime working arrangements.
• Enjoy extended seasonal holiday periods.
• Access a flexible cafeteria-style employee benefits programme.
• Benefit from a Defined Contribution Corporate Pension Plan.
• Receive full commuting cost subsidies in accordance with company policy.
• Take advantage of applicable family and housing allowances.
• Build a long-term career in Japan's advanced semiconductor manufacturing sector through a permanent position in Nagoya.

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