Semiconductor Process Engineer - 300mm Wafer | Mie

Join an established semiconductor foundry as a Semiconductor Process Engineer, developing and optimising advanced module processes and high-volume manufacturing technologies for 300mm wafer fabrication.

In this role, you will work across core semiconductor manufacturing processes including lithography, etching, diffusion, CMP, CVD, PVD and ion implantation. You will contribute to module technology integration, yield improvement, equipment management and mass-production ramp-up for advanced foundry applications.

You will also play an important role in developing manufacturing technologies for next-generation power devices and high-value-added foundry options, helping improve process stability, productivity and cost efficiency.

This is an excellent opportunity for an experienced semiconductor engineer to deepen their expertise in process development, process integration and high-volume manufacturing within a large-scale 300mm wafer fabrication environment.

Key Responsibilities

• Develop and support high-volume semiconductor manufacturing processes across lithography, etching, diffusion, CMP, CVD, PVD and ion implantation.
• Execute semiconductor process integration activities for advanced foundry applications.
• Develop and optimise module-level process technologies for 300mm wafer fabrication.
• Design manufacturing processes and manage related equipment to expand high-value-added foundry options.
• Lead and support mass-production ramp-up for specialised foundry technologies and next-generation power devices.
• Develop and refine manufacturing technologies to improve yield and process stability.
• Drive productivity improvements and cost-reduction initiatives across semiconductor manufacturing operations.
• Provide technical support for semiconductor processes and manufacturing equipment across the foundry business.
• Collaborate with relevant engineering and manufacturing teams to resolve technical issues and support stable mass production.

Required Skills and Qualifications

Experience:

• Practical experience in semiconductor process development, process integration or process ramp-up.
• Hands-on experience involving one or more of the following: vertical furnaces, wafer cleaning, ion implantation or single-wafer RTP.
• Demonstrated experience in semiconductor process development or module-level process technology.
• Hands-on background in power device development, manufacturing engineering, production technology or back-end process development.
• Technical college (KOSEN) graduation or higher in a relevant discipline.
• Solid foundational understanding of semiconductor technologies and manufacturing principles.

Soft Skills:

• Strong sense of ownership with the ability to take responsibility for assigned projects and drive them forward.
• Proactive mindset and willingness to continuously learn new semiconductor technologies.
• Strong problem-solving approach when addressing manufacturing and process challenges.
• Ability to work effectively with engineering and manufacturing teams.
• Commitment to improving process stability, yield, productivity and manufacturing performance.

Language Requirements:

• Japanese: Fluent level.
• English: TOEIC 500+ or practical experience using English in a business environment.

Preferred Skills & Qualifications

• Previous professional experience within the semiconductor manufacturing industry.
• Experience working in a semiconductor foundry or high-volume wafer fabrication environment.
• Experience with 300mm wafer manufacturing.
• Knowledge or experience across lithography, etching, diffusion, CMP, CVD, PVD or ion implantation.
• Experience with advanced semiconductor module integration.
• Experience developing or manufacturing power semiconductor devices.
• Experience supporting mass-production ramp-ups, yield enhancement or process optimisation.

About the Company

Our client is an established contract semiconductor manufacturer operating large-scale 300mm wafer fabrication facilities.

Supported by an international foundry group, the company provides advanced semiconductor technologies across logic, module and power devices for global markets.

Its large-scale manufacturing environment provides semiconductor engineers with opportunities to contribute to advanced process development, technology integration and high-volume production while helping bring next-generation semiconductor technologies into mass production.

Why You'll Love Working Here

• Drive key technical innovations for next-generation power devices and advanced 300mm foundry solutions.
• Play an important role in semiconductor process development and mass-production ramp-up.
• Build expertise across module integration, yield enhancement, manufacturing technology and equipment management.
• Work within a large-scale 300mm semiconductor wafer fabrication environment.
• Receive competitive compensation with structured salary progression.
• Benefit from performance bonuses twice a year.
• Receive overtime compensation calculated on a minute-by-minute basis.
• Maintain excellent work-life balance with flex-time options and 126 annual holidays.
• Enjoy long seasonal holidays and 23 days of annual paid leave.

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